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Ultracompact Displacement Sensor



Temperature correction is enabled by mounting a temperature sensor on the sensor substrate.



Design flexibility is improved by separating the sensing parts and mounting parts.



Space-saving and low cost are achieved by mounting multiple sensors on one substrate.



The heat conductivity of the substrate is increased by using a ceramic substrate as the sensor substrate.


The sensing part is made thinner by using a flexible substrate as the sensor substrate.



Space-saving and low cost are achieved by mounting multiple sensors on one substrate.



IC substrate for evaluating coils


 


 



Example of using the sensor
Pressure sensing with an electronic pen



Example of using the sensor
Load sensing